Answer: Direct-plug LED (Lamp-LED), surface-mount LED (SMD-LED), power LED (High-Power-LED), chip-on-board direct-plug LED (COB-LED), side-LED, chip-LED, UVC LED.
Answer analysis: According to the different packaging forms of LED, it can be divided into the following categories:
1. Direct-plug LED (Lamp-LED):
- An early LED packaging form that uses a potting process. Liquid epoxy resin is injected into the LED molding cavity, and then the pressed LED bracket is inserted, and the epoxy resin is cured in an oven to form.
- Due to the relatively simple manufacturing process and low cost, it has a high market share.
- Commonly used in indicator lights, instrument displays and other occasions.
2. Surface-mount LED (SMD-LED):
- Also known as SMD LED, it is a packaging form attached to the surface of the circuit board, suitable for SMT (surface mount technology) processing, and can be reflow soldered.
- Solved the problems of brightness, viewing angle, flatness, reliability, consistency, etc., and adopted lighter PCB board and reflective layer materials to reduce the weight of the product.
- Currently, it is one of the packaging structures with the highest market share in the LED market.
3. Power LED (High-Power-LED):
- In order to obtain high-power and high-brightness LED light sources, manufacturers are moving towards high-power in terms of LED chip and package design.
- This type of LED package can withstand higher power, such as several watts or even higher, and is suitable for lighting, backlighting and other occasions that require high brightness and high power.
- The package structure is diverse, such as multi-chip combination package using hexagonal aluminum plate as the base.
4. Chip-on-board direct-mounted LED (COB-LED):
- Multiple LED chips are directly packaged on a metal-based printed circuit board (MCPCB) and heat is directly dissipated through the substrate.
- It has the advantages of reducing thermal resistance, increasing package power density and reducing costs.
- It is mainly used for LED packaging of high-power multi-chip arrays, which is one of the mainstream directions of future lighting design.
5. Other special packaging forms:
- Side-LED (side-emitting LED): used in occasions such as LCD backlight that require side-emitting light, and side-emitting light is achieved through designs such as reflectors.
- Chip-LED: extremely thin surface-encapsulated LED, with the advantages of high brightness and small size, suitable for small products and special environments.
- UVC LED: LED packaging form designed for applications such as ultraviolet sterilization and disinfection, focusing on thermal management and heat dissipation.
In summary, there are many different forms of LED packaging, each of which has its specific application scenarios and advantages. With the continuous advancement of technology and changes in market demand, new packaging forms are constantly emerging.