Question

What are the application scenarios of Unilumin Technology's COB packaging technology?

Answer 1

Unilumin Technology's COB packaging technology, centered around a full flip-chip design, achieves technological breakthroughs through a number of innovative processes. Its technical framework encompasses five key process pillars:

Chip: Utilizes a full flip-chip RGB Micro-class chip, equipped with a proprietary mixed die bonding algorithm, enhancing product consistency and leading industry-leading die bonding efficiency.

Substrate: Utilizes an HDI M-SAP process, achieving higher pad dimensional accuracy and addressing module color cast issues.

Packaging: Developed proprietary EBL+ multi-layer optical processing technology achieves a 30,000:1 contrast ratio, combined with upgraded molding processes to address viewing angle and reflection challenges.

Driver: EDL+ driver technology supports 3ns pulse width low-grayscale correction, significantly improving dynamic contrast.

System: The entire product line is compatible with the UOS system, achieving high color reproduction and detailed display.

Distinctive Technical Advantages: Products are certified for carbon peak and carbon neutrality, and quadruple energy-saving technologies reduce power consumption and extend lifespan. Outdoor COB products boast brightness exceeding 7,000 nits, a contrast ratio exceeding 10,000:1, and IP65 protection, making them suitable for extreme environments.

Relying on the Daya Bay Intelligent Manufacturing Base, Unilumin has achieved fully automated production, with a production capacity of 2,000KK/month. It plans to increase its production capacity by 30% annually, forming a leading layout of "full process flow, full product form, and full application scenarios", and continuously leading the development of micro-pitch display technology.

Answer 2

As a leading company in the LED display field, Unilumin Technology's COB packaging technology, with its high integration, high reliability, and excellent display performance, has achieved full coverage in all scenarios, from indoors to outdoors. The following is a detailed analysis of its core application scenarios and technical advantages:

I. Core Application Scenarios

1. Outdoor Display

Milestone: Unilumin Technology launched the world's first outdoor COB product, achieving a technological breakthrough from indoors to outdoors. With a brightness exceeding 7,000 nits and a contrast ratio of 10,000:1, it supports stable all-weather operation and was successfully used in the immersive digital display on the West Lake of the Hangzhou Asian Games.

Technical Advantages: Through its unique dual-chip display technology (increasing brightness by over 100% and reducing energy consumption by 50%), IP65 waterproof packaging (full potting technology + module back-potting), and LVDS differential transmission technology (extending transmission distance and reducing failure rate by 60%), Unilumin Technology solves the industry challenges of high outdoor brightness, dust and water resistance, and signal stability.

2. Professional Display Scenarios

Command Centers and High-End Conferences: Utilizing a fully flip-chip RGB Micro-level chip and proprietary die bonding and hybrid encoding algorithms, this product achieves 180-degree color-blind display, eliminating module color cast issues. This product is carbon neutral and carbon label certified, and supports 5G+8K UHD transmission (data transmission speeds increased by 400%), meeting the needs of scenarios such as smart city "cloud+device" and industry command centers.

xR Virtual Studios and New Commercial Displays: COB-based Mini/Micro LED products support high frame rates (120Hz/240Hz) and dynamic images. Combined with EBL+ multi-layer optical processing technology (with a contrast ratio of up to 30,000:1), they deliver exceptional image quality for virtual filming and commercials.

3. Consumer and Creative Display Scenarios

Home Theater and All-in-One Conference Stations: The UMicro series features quad-step energy-saving technology, reducing power consumption by 40% and keeping the screen temperature as low as 36°C, creating a "cool screen" experience. This fully flip-chip COB conference station delivers a cinema-quality conferencing experience, meeting the needs of enterprise digital upgrades. Outdoor Glasses-Free 3D and Creative Form Factors: Through upgraded molding materials and processes (improving light mixing uniformity) and a magnetic mounting module design (8-piece magnetic mounting + front maintenance), installation and maintenance costs are reduced, supporting creative display solutions such as special-shaped and curved screens.

II. Technical Support System

The performance advantages of Unilumin Technology's COB products stem from five key process support factors:

Chip: Fully flip-chip RGB Micro-level chip + proprietary die bonding mixed-coding algorithm improves consistency and die bonding efficiency.

Substrate: Utilizing the HDI M-SAP process, the pad size accuracy is higher, eliminating module color cast issues.

Packaging: EBL + multi-layer optical processing technology achieves a 30,000:1 contrast ratio, and upgraded molding processes completely resolve viewing angle issues.

Driver: EDL + driver technology supports 3ns pulse width low-grayscale correction, significantly improving dynamic contrast.

System: The self-adaptive UOS system delivers high color reproduction and detailed display, supporting fully automated repair (Automated AOI defective pixel detection, with return shipping within 48 hours).

III. Market Layout and Capacity Planning

Full-Scenario Coverage: Unilumin Technology has developed six product series (UMicro, UMini III Pro, UMini III, UMini W, LMini, and outdoor COB) covering pixel pitches from P0.4 to P4.0, addressing seven major industry application scenarios, including smart cities, smart conferences, and sports venues.

Capacity Expansion: Leveraging the world's largest LED display intelligent manufacturing base in Daya Bay Science and Technology Park, Unilumin achieves fully automated production processes including die bonding, sealing, testing, and packaging. The total production capacity reaches 2,000KK/month, with a planned 30% annual increase to consolidate its leading position in the industry.

IV. Industry Trends and Future Outlook

According to DISCIEN's forecast, COB's share of the domestic fine-pitch LED display market will approach 25% in 2025. TrendForce data indicates that the LED display market is expected to exceed US$13 billion in 2026.

Through vertical integration of the industry chain (packaging, modules to display screens) and a "2+5+1" technology layout (two cores + five supports + one platform), Unilumin Technology continues to promote the evolution of COB technology towards higher definition, lower power consumption, and wider application scenarios, leading the industry into a new "visual" era of micro-displays.

Answer 3

Unilumin Technology's COB (Chip on Board) packaging technology is widely used in various fields, particularly in Mini LED and Micro LED display products. The following are some of the main application scenarios for Unilumin's COB packaging technology:

1. Indoor Applications: Unilumin Technology indicates that Mini/Micro LED applications based on COB packaging will become mainstream in indoor applications with a pixel pitch of 0.4-1.8mm. These products are suitable for high-definition and stable environments, such as high-end conference rooms and command centers.

2. Outdoor Applications: Unilumin has launched the world's first outdoor COB product. This product offers advantages in protection, image quality, lifespan, and weather resistance, making it suitable for applications such as outdoor billboards and public information displays.

3. Data Transfer Speed Enhancement Solutions: For applications requiring fast data transmission, such as 5G communication-related display solutions, Unilumin offers products with higher bandwidth that significantly improve data transmission speeds.

4. Ultra-High Brightness Display Solution: For outdoor environments requiring extremely high brightness, Unilumin has launched an outdoor COB solution with a brightness of up to 7000 nits, ensuring clear visibility even in direct sunlight.

5. Creative Display: Leveraging the unique features of COB packaging technology, Unilumin has also developed creative display solutions to meet the personalized needs of different customers.

6. All-in-One Conference System: Unilumin offers fully flip-chip COB all-in-one conference systems, providing users with a cinema-quality conferencing experience, enhancing interactivity and visual quality.

7. Micro-Pitch Display: With the development of Mini/Micro LED, Unilumin's COB technology has gradually penetrated into products with smaller pitches, including the UMicro and UMini series. These products cover a wide range of pixel pitches from P0.4 to P4, achieving full coverage of application scenarios.

In short, Unilumin Technology's COB packaging technology not only improves the performance and reliability of display products, but also, through continuous technological innovation and process optimization, expands its application range to cover a wide range of fields, from indoor and outdoor, and from professional displays to commercial displays.