Question

What are Die Bond Interconnect Layer Materials?

Answer 1

The die-bonding interconnection layer material refers to the key material used to connect the LED chip and the substrate during the LED packaging process.

It undertakes the important functions of electrical interconnection, heat dissipation and mechanical support. The selection of die-bonding interconnection layer materials has a crucial impact on the heat dissipation performance, reliability and luminous efficiency of LED devices.

The main die-bonding interconnection layer materials on the market currently include insulating glue and conductive silver glue. Insulating glue is divided into high thermal conductivity insulating glue and low thermal conductivity insulating glue due to its different thermal conductivity, and is mainly used for low-power LED devices.

Conductive silver glue is widely used in high-power LED devices due to its mature technology and high thermal conductivity. In addition, in flip-chip LEDs, solder paste and gold-tin alloy are also often used as die-bonding interconnection materials. The selection of these materials needs to comprehensively consider factors such as the heat dissipation requirements, reliability requirements and cost of LED devices.

Answer 2

The die-bonding interconnection layer material plays a key role in LED packaging. The main materials include insulating glue and conductive silver glue.

* Insulating glue: Due to its different thermal conductivity, it is divided into high thermal conductivity insulating glue and low thermal conductivity insulating glue. It is mainly used for low-power LED devices. Because of its low heat generation, low-cost insulating glue can meet the heat dissipation requirements.

* Conductive silver glue: The technology is mature and the thermal conductivity is high. It is widely used in high-power LED devices. Compared with insulating glue, conductive silver glue can more effectively reduce the chip temperature and improve the heat dissipation performance. In flip-chip LEDs, solder paste and gold-tin alloy are also often used as die-bonding interconnection materials. They have the advantages of high thermal conductivity and low thermal resistance, but they are expensive and the process is complicated.

In summary, choosing the right die-bonding interconnection layer material is crucial to improving the heat dissipation performance and reliability of LED devices.

Answer 3

The chemical properties of the die-bonding interconnection layer material are mainly reflected in its conductivity, thermal conductivity, adhesion and stability.

1. Conductivity: For conductive materials such as conductive silver glue, it contains conductive particles such as silver powder, which makes the material have excellent conductivity and can effectively connect the LED chip and the substrate to achieve current transmission.

2. Thermal conductivity: The die-bonding interconnection layer material needs to have good thermal conductivity so that the heat generated by the LED chip can be transferred to the substrate in time to avoid overheating of the chip and affecting the performance. Conductive silver glue and some high thermal conductivity insulating glues are excellent in this regard.

3. Adhesion: Whether it is insulating glue or conductive silver glue, it needs to have sufficient bonding strength to ensure that the LED chip can be firmly fixed on the substrate to prevent it from falling off during subsequent processes or use.

4. Stability: The die-bonding interconnection layer material needs to maintain stable performance under various environmental conditions, including temperature, humidity, chemical corrosion, etc. This is crucial to ensure the long-term reliability and service life of LED devices.

In summary, the chemical properties of the die-bonding interconnect layer material are the basis for its functional realization and are also one of the key factors affecting the performance of LED devices.