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What is a sub-surface mount module and what are its advantages and disadvantages?

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Subsurface Mounted Diode (SMD) is a packaging form of electronic components, mainly used in electronic products such as LED displays. SMD LED encapsulates the light-emitting chip of the LED lamp bead inside the substrate, and the light-emitting part is transmitted through the packaging colloid.

Advantage:

1. Small size: The size of SMD LED is much smaller than traditional plug-in LED, which makes it more suitable for high-density, small-size LED display applications.

2. High brightness: Since the light-emitting chip of SMD LED is directly packaged inside the substrate, the light loss is small, so its brightness is usually higher than that of traditional LED.

3. High reliability: The packaging structure of SMD LED is relatively stable and has strong adaptability to the environment. Environments such as vibration, shock, humidity, etc. have less impact on it, so its reliability is high.

4. Ease of automated production: Due to the small size and light weight of SMD LEDs, it is easier to implement automated production and improve production efficiency.

Disadvantage:

1. Difficulty in repair: Since SMD LEDs are packaged inside the substrate, if damage or failure occurs, the entire LED usually needs to be replaced, rather than being replaced individually like traditional LEDs.

2. Relatively high cost: Although SMD LEDs have higher production efficiency, their costs are usually slightly higher than traditional LEDs due to the complexity of their packaging technology and the need for more sophisticated equipment and materials.

3. Heat dissipation issues: Due to their small size, SMD LEDs have relatively poor heat dissipation capabilities. Therefore, special attention needs to be paid to heat dissipation issues when using them to avoid performance degradation or damage caused by overheating.

In general, SMD LED has broad application prospects in electronic products such as LED displays, but it is also necessary to choose the appropriate packaging form according to specific application scenarios and needs.

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Sub-surface mount is a product between DIP and SMT. The packaging surface of its LED lamp is the same as that of SMT, but its positive and negative pins are the same as those of DIP. They are also welded through the PCB during production. The advantages are: high brightness and good display effect. The disadvantages are: complex process and difficult maintenance.

by (63.1k points)

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