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What kind of packaging glue do we usually use for our direct plug-in lamp beads?

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Answer: Epoxy resin (EPOXY), silicone (SILICONE), UV encapsulation glue, PES encapsulation glue and TPU encapsulation glue, etc.

Answer analysis: The following are the commonly used encapsulation glues in the encapsulation process of direct plug-in lamp beads (Lamp-LED):

1. Epoxy resin (EPOXY):

- Epoxy resin is a two-component curing epoxy resin glue with high strength, high hardness, good temperature resistance and good shock resistance. This makes it an ideal material for protecting LED lamp beads and fixing them on PCB boards. However, epoxy resin has relatively poor yellowing resistance and UV resistance, so other materials may need to be considered in certain specific environments.

2. Silicone (SILICONE):

- Silicone encapsulation glue has the advantages of heat resistance, cold resistance, good insulation and strong weather resistance. It can protect LED lamp beads from high temperature, humidity, acid and alkali and other environmental effects, thereby extending the life of LEDs. Although the strength and hardness of silicone are not as good as epoxy resin, its flexibility and weather resistance make it one of the commonly used materials for direct plug-in lamp bead encapsulation.

3. Other encapsulants:

- In addition to epoxy resin and silicone, there are other types of encapsulants such as UV encapsulants, PES encapsulants and TPU encapsulants. However, these materials are relatively less used in direct plug-in lamp bead encapsulation and may be more used in other types of LED encapsulation or specific fields.

When choosing an encapsulant for direct plug-in lamp beads, multiple factors need to be considered, including the specific use of the LED, environmental conditions, heat dissipation requirements, and cost. For example, if the LED lamp beads need to withstand high temperatures or harsh environmental conditions, then silicone may be a better choice; while if more attention is paid to cost and strength requirements, epoxy resin may be more suitable.

In addition, with the continuous advancement of technology and the continuous emergence of new materials, more new encapsulants suitable for direct plug-in lamp bead encapsulation may appear in the future. Therefore, when choosing an encapsulant, it is also necessary to pay attention to the latest trends and technological developments in the industry.

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