COB and SMD are two different LED packaging technologies. The differences lie in the packaging method, product point spacing and manufacturing cost. COB uses LED chips to be directly packaged, with smaller point spacing, and is suitable for fine-pitch LED displays, but the cost is higher.
SMD technology is mature and low-cost, and is suitable for conventional pitch LED displays. In the long run, COB technology has greater development potential.
When customers search for LED displays, they often see merchants promoting the COB process, but the current traditional packaging technology is the SMD process. So what is the difference between COB and SMD, and which one is better? Today we will decipher it.
Let’s talk about the conclusion first. There are three differences between COB and SMD. They are different packaging methods, different point spacing of the products provided, and different manufacturing costs.
1. Differences in packaging methods
SMD packaging, also called surface mount packaging, is a packaging method used in traditional LED displays. It is a method of first packaging LED chips into lamp beads, and then welding the lamp beads to the PCB board to achieve luminescence. Way. For example, current outdoor LED displays are basically packaged in SMD.
COB packaging uses LED chips to be directly packaged. Instead of being packaged into lamp beads, the chip is directly implanted. The advantage of this is that the process is simpler and the point spacing can be smaller.
2. The difference between dot spacing
The dot pitch of SMD-packaged LED displays can be as large as P20 and as small as P1.25. However, if you want to continue to make the dot spacing smaller, it will not be easy to achieve.
COB packaging was introduced to solve the problem of inability to make the point spacing smaller. It mainly focuses on products of P1.25 and below, such as P0.93, P0.78, etc., all using COB technology.
4. Cost difference
SMD packaging has been launched for a long time, and the technology is mature. Now the cost has dropped a lot, so it is relatively cheaper.
The COB packaged LED display screen has been launched for a short time, and the price and cost are still relatively high. In addition, it mainly produces fine pitch LEDs below P1.25, so the cost is also much higher.
Comprehensive comparison of the differences between COB and SMD can be seen that these are two different packaging technologies. COB is mainly targeted at LED displays in the field of fine pitch. With the continuous advancement of technology and the gradual recognition of the market, COB packaging technology is expected to become the leading trend in the field of electronic packaging, leading the industry to a more efficient and reliable future. Although SMD technology still has its value in some specific application scenarios, in the long run, the development potential and market competitiveness of COB technology are undoubtedly more advantageous.