The main differences between COB packaging technology and traditional packaging technology are reflected in the following aspects:
1. Packaging method: COB packaging technology pastes the bare chip (including the chip body and I/O terminals) directly on the PCB and uses conductive/thermal conductive glue for connection. Traditional packaging technologies mainly use pins as the main connection method, such as dual in-line packaging (DIP), small outline package (SOP), and quad mount package (QFP).
2. Production freedom: COB packaging technology improves the freedom of assembly. Since the chip is directly pasted on the PCB, a separate chip welding process is omitted, making later product assembly and maintenance more convenient. Chips in traditional packages are usually processed and welded separately on the production line. Once a problem occurs, it is difficult to replace it.
3. Heat dissipation performance: COB packaging technology has better heat dissipation performance. Since the chip is directly attached to the PCB and its back is in direct contact with the PCB, the heat can be conducted better. However, the chip in the traditional package is welded on the PCB, and heat dissipation mainly relies on the heat sink on the surface of the chip, and its heat dissipation effect is relatively poor.
4. Application fields: Traditional packaging technology is more suitable for early integrated circuit products due to its lower production cost and higher production efficiency. COB packaging technology has more advantages in some specific areas such as high-density, high-performance or special-demand integrated circuit products.
To sum up, there are significant differences between COB packaging technology and traditional packaging technology in packaging methods, production freedom, heat dissipation performance and application fields. In practical applications, the appropriate packaging technology can be selected based on the specific needs and characteristics of the product.