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What is GOB LED display screen?

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GOB LED display is an LED display using GOB packaging technology. GOB is the English abbreviation of GLUE ON THE BOARD (glue on the board). It uses a special optical thermal conductive nano-scale glue material to combine the conventional LED display PCB board and its patch lamp beads with double fog through a special process. Surface optical treatment achieves a frosted effect on the surface of the LED display.

GOB packaging technology improves the existing protection technology of LED displays and innovatively realizes the conversion and display of display point light sources from surface light sources. This technology can well solve the problem of LED display screens being prone to dead lights and falling lights, because it fills the gaps between the lamp beads and enhances the stability of the LED lamp beads. At the same time, the GOB LED display is also anti-collision, dustproof, waterproof, moisture-proof, and UV-proof. It will not have any harmful effects on heat dissipation and brightness loss, and even helps to dissipate heat, thereby extending the service life.

GOB technology supports various LED displays, such as indoor LED screens, outdoor LED screens, small-pitch LED displays, independent chip holographic transparent screens, LED floor tile screens, LED special-shaped screens, etc. Its matte effect significantly improves product color contrast, reduces glare and glare, and reduces visual fatigue. It realizes the transformation from point light source to surface light source, making the product's light emitting more uniform, greatly improving the viewing angle of the product, and effectively eliminating the problem of pitting on the LED display.

In short, GOB LED display is an LED display with excellent performance and wide application prospects.

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+1 vote

GOB, or Glue On Board, is a protective process for placing glue on SMD modules, which can solve the problems of moisture resistance and bumps. It can mainly be used on rental screens, but there are problems with stress relief, heat dissipation, repair and poor colloid adhesion.

by (88.1k points)

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