Liquid crystal display (LCD) panels are favored and have seen rapid development due to their advantages such as lightness and thinness. The manufacturing process of LCD panels directly affects the display performance (brightness, contrast, and color) of LCD devices. LCD panels are generally assembled from an array substrate and a color filter substrate. During the assembly process, a sealing adhesive bonds the array substrate and the color filter substrate together.
LCD Encapsulation: Sealing adhesive is an adhesive used to bond the upper and lower glass panels of an LCD screen together, maintaining a certain gap, and then sealing the injected liquid crystal to prevent leakage and the ingress of external contaminants. This adhesive is called sealing adhesive, also known as edge sealing adhesive.
With the development of LCD devices towards lighter weight, thinner profiles, environmental friendliness, and higher reliability, edge sealing adhesive, as an important material, plays a crucial role in the LCD industry. LCD edge sealing adhesive can seal the liquid crystal to prevent leakage and prevent external heat, moisture, and dust from entering the LCD device and affecting its performance.
With the continuous maturation of process technology and the sustained reduction in production costs, the application fields of LCD products are constantly expanding. The dedicated LCD display product sector has spurred new growth in demand for LCD edge-sealing adhesives. Fields such as industrial control, automotive electronics, and healthcare are increasingly using LCD screens as human-computer interaction interfaces, directly driving the demand for LCD edge-sealing adhesives within the LCD screen industry.
We will continue to research and develop LCD screen edge-sealing adhesives suitable for various application scenarios and meeting a wider range of application requirements.
Currently, we have developed a high-toughness, single-component epoxy LCD sealing adhesive for Chinese LED display manufacturers. This product features good flow properties, excellent adhesive layer toughness, and superior adhesion to materials such as glass, PET, and metal. It can be used for potting chips, electronic paper, and other electronic components.
It features low viscosity, easy leveling, simple process, long working time, flexible adhesive layer, excellent adhesion, suitability for various substrates, and is environmentally friendly and solvent-free.