The full-color COB display lamp bead packaging pad structure is a specific design used for the packaging of full-color COB (Chip On Board) panel lamp beads. This structure usually includes a lamp cup, a first bonding pad, a second bonding pad, a third bonding pad, a fourth bonding pad and a plurality of wafers.
The lamp cup is usually round, and the soldering pad is arranged inside the lamp cup. Specifically, the first pad is in a "T" shape and consists of a horizontal arm and a vertical arm, and the horizontal arm and the vertical arm are located on one diameter of the lamp cup. The second bonding pad is located on one side of the vertical arm, the third bonding pad is located on the other side of the vertical arm relative to the second bonding pad, and the fourth bonding pad is located on the side of the horizontal arm away from the vertical arm.
This design makes the packaging of full-color COB panel lamp beads more stable, the color mixing more uniform, and the light-emitting angle larger. In addition, through precise pad layout and structural design, better electrical and thermal performance can be achieved, ensuring the excellent performance of lamp beads in terms of high brightness, high stability, and long life.
The above is a general description of the full-color COB display lamp bead packaging pad structure. The specific structural design and parameters may vary depending on different products and applications. If necessary, it is recommended to consult relevant technical documents or consult professional technical personnel.