MIP LED display is an advanced display technology that combines Micro LED chips and high-efficiency packaging processes. Here is a detailed explanation of MIP LED display:
1. Technical Principles:
- MIP (Micro LED in Package) displays use Micro LED chips with a size of less than 50 microns, and seamlessly integrate LED chips with discrete devices through advanced packaging technology, bringing more possibilities and advantages to display technology.
2. Key Benefits:
- High brightness and contrast: Thanks to the small size of the Micro LED chip, the MIP display can achieve extremely high light output, and the special design increases the proportion of black, improving the overall contrast and color expression.
- Delicate image quality: It is suitable for indoor ultra-high-definition application scenarios with P0.6-P0.9 dot pitch, providing fine picture quality, especially suitable for large indoor displays, and achieving high-resolution display at 4K and even 8K levels.
- Thinning and low loss: The ultra-thin transparent package architecture reduces the light loss of the chip, improves the brightness, and significantly reduces the overall thickness.
- Consistency optimization: Through the GOB (Glass on Board) packaging scheme and other technical means, the color cast phenomenon is effectively reduced and the color of the picture is uniform without obvious differences.
- Energy savings and long life: Based on the fundamental characteristics of LED technology, MIP displays are expected to have low power consumption and a long service life.
3. Package features:
- MIP packaging is an innovative packaging technology that enables comprehensive measurement and splitting of Micro RGB pixels, ensuring that LED LEDs perform best in terms of brightness, contrast, and color consistency at different viewing angles.
- MIP package provides excellent dust, moisture, and static resistance to LED devices, and can better resist external forces.
- The MIP package of the LED module has excellent heat dissipation performance, with lower power consumption and temperature rise.
4. Application Scenarios:
- The size of MIP (Micro LED in package) chips is getting smaller and smaller, and will be mainly used in small-size displays, such as wearable devices, Micro LED TVs, and automotive displays in the future.
5. Comparison with COB technology:
- MIP (Mini LED in package) can reuse SMD production equipment in terms of manufacturability, reducing heavy asset investment; On the other hand, COB (Chip on Board) technology requires a separate investment in a production line.
- MIP and COB have their own advantages and are suitable for different sizes and scenarios.
In summary, MIP LED display shows great potential and advantages in the field of display technology with its high brightness, high contrast, delicate picture quality, thin and light design, consistency optimization, energy saving and long life. With the continuous development of technology and the gradual reduction of costs, MIP LED displays are expected to be more widely used in various display scenarios in the future.