The COB packaging technology of the LED display screen refers to the chip-on-board packaging technology. It directly integrates the LED light-emitting chip on the PCB board, instead of first packaging it into lamp beads and then welding it like traditional packaging technology. This technology eliminates the bracket and the solder paste connection to the PCB through reflow, thereby increasing the protection capability and avoiding LED failures caused by external collisions.
COB packaging technology can also increase the brightness of the LED display, because the packaging technology uses a combination of polysilicon and organic silicon. This material can increase the brightness of the LED display, making the display have higher contrast and lower power consumption. and longer lifespan.
In general, COB packaging technology is of great significance to the development of LED displays. It can improve the brightness, reliability and performance of the display, making it more suitable for high-end application scenarios. For more information about COB packaging technology, it is recommended to visit relevant technical forums or consult LED display manufacturers.