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What is an indoor flip-chip COB LED display?

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The indoor flip-chip COB LED display is a new display technology that uses the flip-chip COB packaging process. This packaging process allows the LED chip to be directly mounted on the PCB substrate, and the silicon wafer is covered with thermally conductive epoxy and heat treated to ensure that the silicon wafer is firmly fixed on the substrate. Subsequently, electrical connections are established between the silicon wafer and the substrate via wire bonding methods.

Compared with traditional SMD packaging, flip-chip COB packaging has higher brightness and better heat dissipation performance. Due to the simpler structure, the manufacturing process is simplified and gold or copper wire connections are reduced, thereby improving stability and reducing the risk of dead or dropped lights. At the same time, this packaging method can also achieve smaller point spacing and provide ultra-fine spacing display effects, making the graininess less obvious when viewed at close range, and is especially suitable for indoor short viewing distance situations.

In addition, the indoor flip-chip COB LED display is also collision-resistant and not afraid of being touched. Since the light-emitting chip is directly packaged on the PCB and cured with epoxy resin glue, the device is not exposed, so the screen can be wiped directly when it is dirty, making it easy to clean and maintain. Its "surface" light source light-emitting characteristics reduce light refraction, the colors are concentrated and have a good visual effect, and it will not hurt the eyes when viewed at close range for a long time.

In summary, the indoor flip-chip COB LED display has a wide range of application prospects in the field of indoor display due to its excellent display effect, stability and ease of use. It is especially suitable for shopping malls, exhibition halls, conference rooms and other places that require high-quality visual experience. place.

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The indoor flip-chip COB LED display is a high-end indoor display device that uses full flip-chip COB packaging technology. COB (Chip-on-Board) is a technology that directly packages multiple LED chips on the same circuit board. Compared with traditional SMD packaging, it has higher brightness and better heat dissipation performance.

Flip-chip COB technology has the advantages of simple structure, high temperature resistance, good heat dissipation performance, and high stability. It reduces the number of gold or copper wire connections, reducing the risk of dead or dropped lights. It can also make the point spacing smaller, making the graininess less obvious when viewed at close range, and the display effect is clearer and more uniform. In addition, the indoor flip-chip COB LED display is also anti-collision, dustproof and moisture-proof, easy to clean and maintain, and will not hurt your eyes when viewed at close range for a long time.

Indoor flip-chip COB LED displays are mainly used in occasions with extremely high display requirements, such as studios, conference rooms, dispatching and command centers, monitoring and security centers, information centers and demonstration centers, etc. In these occasions, it can provide a clear visual experience, reduce the moiré phenomenon, and make the shooting picture more natural. The monitoring display can enlarge the picture without distortion and ultra-high definition to meet various high-end display needs.

Please note that the specifications, performance and application scenarios of specific indoor flip-chip COB LED displays may vary depending on the supplier and product model. When selecting and purchasing, it is recommended to conduct a comprehensive evaluation based on specific needs and budget, and consult a professional supplier or technical team for more detailed information.

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