LED display flip chip (Flip Chip) is a chip with no lead structure. It is designed by depositing tin lead balls on the I/O pad, then flipping the chip and heating it, and combining the molten tin lead balls with the ceramic substrate. . Compared with the traditional metal wire bonding connection method (Wire Bonding) and the process after ball mounting, the flip chip is characterized by the electrical side facing down, which is equivalent to turning the traditional chip over, so it is called a "flip chip".
LED flip-chip chips are mainly used in high-clock CPU, GPU (Graphic Processor Unit) and Chipset products, as well as in medical equipment, automotive lighting, instrumentation and other fields. Since the I/O terminals are distributed over the entire chip surface, flip-chip has reached its peak in terms of packaging density and processing speed. In particular, it can be processed using methods similar to SMT technology, so it is the ultimate in chip packaging technology and high-density mounting. direction.
In LED displays, flip-chip technology can improve the brightness and uniformity of the display while reducing failure rates and improving reliability. In addition, flip-chip technology can also reduce the thickness and weight of the display, making it lighter and easier to install.