Mini LED chip-scale packaging technology is a packaging process for tiny LED chips. The main purpose of this packaging technology is to protect the chip and realize signal connection to improve stable performance, luminous efficiency and service life. During the packaging process, the chip is precisely packaged in a specific structure to ensure its normal operation and excellent performance.
Specifically, Mini LED chip-scale packaging technology includes a variety of methods, such as COB (Chip on Board) and IMD (Integrated Matrix Devices). COB technology uses multi-lamp bead integrated bracket-less packaging technology to directly package the LED light-emitting chip on the PCB board, improving screen reliability and display effect. IMD technology integrates and packages multiple sets of RGB lamp beads into a small unit, which can reduce product size, improve reliability, and reduce production costs.
In addition, Mini LED chip-scale packaging technology also involves the distinction between formal and flip-chip chips. Formal chip means that the chip is placed directly on the substrate and connected through bonding wires, etc.; while flip-chip places the chip's electrodes downward and directly connects with the electrodes on the substrate to achieve a more efficient electrical connection.
With the development of technology, Mini LED chip-scale packaging technology is developing in a more advanced, efficient and reliable direction. For example, new packaging processes are gradually replacing traditional bracket-type packaging, making the packaging structure more compact and improving packaging density and efficiency.
In general, Mini LED chip-scale packaging technology is an important part of the development of LED display technology, providing strong support for the performance improvement and cost reduction of LED displays.