Answer: DIP.
Answer analysis:
Common LED packaging forms include DIP, SMD and COB.
Common LED packaging forms mainly include DIP (Dual In-line Package), SMD (Surface Mounted Device) and COB (Chip on Board).
1. DIP packaging
DIP packaging, full name Dual In-line Package, commonly known as plug-in display, is the first to develop among the three packaging modes. The characteristic of DIP packaging is that the LED chip is encapsulated between two pins, usually in the form of a single LED lamp bead. This packaging form has high brightness and is particularly suitable for outdoor use, and can maintain good display effects under strong light. At the same time, DIP-packaged LED lamp beads also have good waterproof, dustproof and UV protection properties, and are suitable for various harsh environments. However, DIP-packaged displays may be subject to certain limitations in resolution and viewing angle, and the power consumption is relatively high.
2. SMD packaging
SMD packaging, full name Surface Mounted Device, is a surface mount device, which is a type of SMT (Surface Mount Technology) components. SMD packaging integrates red, green and blue LED chips in a small package to form a pixel. Since multiple chips can be integrated in one package, the LED display screen in the form of SMD packaging has high resolution, wide viewing angle and more uniform color performance. At the same time, the display screen in the form of SMD packaging is usually thinner and lighter, suitable for indoor and some light structure application scenarios. In addition, the LED display screen in the form of SMD packaging also has the advantages of mature manufacturing process, large-scale production, small size, low power consumption, and automated manufacturing.
3. COB packaging
COB packaging, the full name is Chip on Board, which is a new packaging method that is different from SMD surface mount packaging technology. COB packaging fixes the LED chip directly on the PCB board and then encapsulates it with epoxy resin to form a module. This packaging method has better heat dissipation performance and helps to extend the service life of the LED. At the same time, COB packaging has strong impact resistance and high protection level, which is particularly suitable for application scenarios with high protection requirements. In addition, COB packaging can also achieve higher pixel density and more uniform light color, which is suitable for high-resolution display for close viewing.
In summary, DIP, SMD and COB are the three most common packaging forms for LEDs, each with its own unique characteristics and applicable scenarios. When choosing a packaging form, you need to decide based on the specific usage environment and display requirements.